3D CORE Superiority

  1. Using high thermal conductivity materials and an innovative adhesive technique
  2. Special aluminum alloy base material for high thermal conductivity
  3. Patented direct curved surface forming circuit technique
  4. Patented SMD curved process with seamless adhesion
  5. Special scheme for LED arrangement for optimal heat distribution
  6. Proposed IR thermal imaging photos
  • 3D CORE Inspection report-IR Thermal Imaging Photo-2W

 

  • 3D CORE Inspection report-IR Thermal Imaging Photo-3W